IEC Edition INTERNATIONAL. STANDARD. NORME. INTERNATIONALE. Electric components – Reliability – Reference conditions for . Purchase your copy of BS EN as a PDF download or hard copy directly from the official BSI Shop. All BSI British Standards. EXAR is a Windows software suite for. PCs to calculate failure rates. EN/IEC or MIL-HDBKF can optionally be used as the basis of this calculation for.

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Even 5 years is difficult. The idea, in part, is to bridge the approach and physics of failure approach. How do you make your reliability predictions?

Predicting MTBF or creating an estimate is often requested by your customer or organization.

Reliabilty Predictions – No MTBF

Accurate and useful predictions cannot be done for most causes of early life failures in electronics and we must educate those that still believe it can be and 67109 asking for MTBF predictions. Reference conditions for failure rates and stress models for conversion Status: We need to make decisions today about design and assembly decisions that may impact product performance 20 years in the future. Yes, it takes work 6170 order to predict the future, the best way is to wait and measure it.

Notify me of follow-up comments isc email. Good stuff in this document. I consider three classes or sources of product failures, all of which we have an interesting in estimating. And this is the continuing dilemma, no electronics manufacturer or design company will ever release the actual causes or rates of failures that their products have seen in the field without a court order.

There may be others. Find Similar Items This product falls into the following categories. You may find similar items within these categories by selecting from the choices below:. This website is best viewed with browser version of up to Microsoft Internet Explorer 8 or Firefox 3. Often we do not have time for this approach.


In 611709 meantime, do not use Mil Hdbk as it is sorely out of date. The problem is more fundamental that accurate models of intrinsic physics of failures of components. Most electronics do not fail.

It may take some work. Using a current physical of failure model may require some thinking, additional data and a 661709 of research. There is work to update the standard to the G revision and is making progress. You will notice familiar equations for electrolytic capacitor life and the Arrhenius equation, and a many more. Leave a Reply Cancel reply Your email address will not be published.

BS EN 61709:2017

Fred you make some very good points, especially about the inaccuracies and invalidity of Mil handbook book and its progeny. Sorry, your blog cannot share posts by email. Because of the lack of distributed knowledge on causes of real warranty failures the belief and decades long delusion that the rates of failures of electronics with no moving parts can be predicted. The equations and data used for fitting parameters are conservative. Instead most are turned off because the replaced by something much more capable with more features or benefits.

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Accept and continue Learn more iiec the cookies we use and how to change your settings. Hi Kirk, I consider three classes or sources of product failures, all of which we have an interesting in estimating. The faster, easier way to work with standards. Supplier and assembly faults Overstress faults Wear out faults As any product that has been out there for some time experiences is a rate of occurrence of all of these types of faults.


Reference conditions for failure rates and stress models for conversion. What decisions are you making and are they important?

What are you being asked to forecast? You have to come up with something.

You are being specifically asked for MTBF for a new product. The IEC Rev 2. Predicting the future, including failure rates of electronic products with no moving parts, would be extremely valuable if it could be done. Search all isc by. We use cookies to make our website easier to use and to better understand your needs.

While not a full textbook, it make a major step forward. All models are wrong, some are useful.

The standard still uses failure rates and modifications as the structure. More models and it includes some of the how and why to apply, including assumptions. Stress, Environment workingMathematical calculations, Semiconductor devices, Optoelectronic devices, Integrated circuits, Indicator lights, Relays, Diodes, Capacitors, Resistors, Transformers, Electric coils, Switches, Inductors, Reliability, Failure quality controlElectronic ied and components.

You have recently published that basing decisions on assumed averages will provide wrong answers and I certainly agree. So, why the article on predicting MTBF? Your email address will not be published. Compounding the challenge of prediction is that it requires many broad assumptions about average end use stress environment, use profile, and capability and consistency of the manufacturing processes at many levels of assembly.